Shielding laminates, unlike metal, are non-conductive at their core. While metals like copper are conductive by nature, shielding laminates formed with non-metals excel as insulating or signal shielding materials, which do not respond to electric fields and resist the flow of electric charge.

Vacuum metallization encompasses methods like vacuum deposition, sputtering, and ion plating, which create various metal and non-metal films on product surfaces within a vacuum environment, achieving the effect of plating.

The main difference between electroplating and vacuum metallization is the cost. Vacuum metallization is generally more expensive, and its process complexity is higher compared to electroplating.

Copper/PET shielding tapes is primarily used in various fields, such as extremely fine coaxial wires, low-loss antennas (computers), solar cell wires, etc.

EMI solutions include three main approaches: electromagnetic interference shielding, printed circuit board grounding, and electromagnetic interference absorption.

• Electromagnetic Interference Shielding involves blocking electromagnetic noise and attenuating cable-collected noise. It uses high-reflectance materials (usually low-resistance metals) to encase or seal openings in target devices for EMI and EMS solutions.
• Printed Circuit Board (PCB) Grounding refers to grounding electronic equipment electrically to prevent electric shock, treating the Earth as a massive conductor at zero electric potential. Two grounding methods are employed: frame grounding and signal grounding on PCBs.
• Electromagnetic Interference Absorption (EMI Absorption) utilizes magnetic loss, dielectric loss, and conduction loss to convert radio wave energy into thermal energy. EMI absorbers have a wide range of applications.